Juergen Hasch, Bosch, Germany
Hiroshi Kondoh, EHF Consulting, Japan
Tim Lee, Boeing, USA
John Papapolymerou, Michigan State University, USA
George E. Ponchack, NASA, USA
Atsushi Sanada, Osaka University, Japan
Hasan Sharifi, HRL Laboratories, USA
Andreas Stelzer, Linz University, Austria
Erik Ström, Chalmers University, Sweden
Cicero S. Vaucher, NXP Semiconductors, The Netherlands
Ke Wu, Polytechnique Montréal, Canada
Thomas Zwick, Karlsruhe Institute of Technology, Germany